An Integrated System for Design Automation of VLSI Interconnects and Packaging
نویسندگان
چکیده
The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing iruportance with higher circuit integration and system perfor1nanc.e. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, ('AD framework development and evaluations for performance, riianufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system i n development, its implementation and applications.
منابع مشابه
Characterization of Self-Heating in Advanced VLSI Interconnect Lines Based on Thermal Finite Element - Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on [see also Compon
In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today’s. The paper proves the necessity for extending the system of design rules, proposes a thermal design rule, and presents an efficient and quantitatively accurate thermal simulator as tool for the design process.
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